PCBA Stress and Strain Tester Circuit Board Stress Detector TSK-64-40C

PCBA Stress and Strain Tester Circuit Board Stress Detector TSK-64-40C

I. Overview of TSK-64-40C Circuit Board Stress Detector 

 The TSK-64-40C is a circuit board stress detector, belonging to the TSK-64 series of stress testers. It is a portable stress tester with a wide range of applications in circuit board stress detection, such as ICT stress testing, FCT stress testing, assembly stress testing, drop stress testing, etc. It can also be used for air conditioning pipeline stress testing, glass stress testing, and stress testing of some structural components.

 II. Performance Parameters of TSK-64-40C - Number of channels: The main unit has 64 channels, configured with 40 channels, expandable, and supports 120-ohm strain gauges.

 Signal acquisition: Can acquire signals from 120-ohm strain gauges.

Sampling rate: The maximum sampling rate is 10KHz (64 channels sampled simultaneously), and the maximum sampling rate for a single module chassis is 80KS/s. 

Operation menu: The operation menu is presented in a dialog box format, with a Chinese interface, making it simple and quick to operate, and easy for users to get started.

 Other parameters - Number of channels per module: 8/4 analog input channels. - ADC resolution: 24-bit.

Supported Wheatstone bridge types: 1/4 bridge.

Conversion accuracy: 3.5062nV/V/LSB.

 III. Compliance with Standards and Report Generation The TSK-64-40C incorporates international strain gauge testing standards, such as the Intel standard and IPC-9704 standard. It can automatically generate reports with a single click and determine "Pass" or "Failed," which helps quickly evaluate circuit board stress test results. It is suitable for rapid measurement in factories and provides timely test conclusions.

 IV. Significance in Circuit Board Testing 

 With the development of circuit board manufacturing technologies, such as lead-free processes, the widespread use of new PCB laminate materials, and increased interconnect density, circuit boards may experience various failure modes due to stress during assembly, testing, and operation, such as solder ball cracking, circuit damage, capacitor Y-type cracking, and 45°-type cracking. The TSK-64-40C stress detector can objectively analyze the strain and strain rate levels experienced by SMT packages during PCBA assembly, testing, and operation. This helps identify potential issues, avoid circuit board failures caused by stress, reduce material costs, and save time wasted on cross-departmental investigations.

 In multiple stages of circuit board manufacturing, such as depanelization/board separation processes, all manual handling processes, all rework and touch-up processes, connector/component installation in SMT assembly, as well as mechanical assembly processes like heat sink assembly, spacer/reinforcement plate assembly, and system or system board assembly, the TSK-64-40C can monitor the stress conditions of circuit boards to ensure their reliability throughout the entire production process.

For more model parameters, please contact 13662640131  (same number for WeChat)